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Ball Connected Multi-Module Carrier

IP.com Disclosure Number: IPCOM000004368D
Publication Date: 2000-Oct-18
Document File: 2 page(s) / 144K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a technique for packaging large number of devices (chips) in close proximity.

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Ball Connected Multi-Module Carrier

Packaging a large number of devices (chips) in close proximity has become feasible because of the low power dissipation and high reliability of CMOS technology. The close proximity of devices reduces propagation delays, which enables higher speed system operation. The low power dissipation enables dense packing of devices for small light-weight products, which can still be cooled by conventional means. Relatively low power semiconductor dice (chips) require minimum packaging. Disclosed is a technique for packaging large number of devices in close proximity.

Figure 1 is a cross section of an carrier/module assembly consisting of a carrier and one or more modules. Each module contains one or more semiconductor dice. The module is adapted to physically and electrically attach to the carrier.

Carrier 100 is composed of ceramic or organic insulating material and conductive wires. The wire may be formed from copper or other conductive materials. Carrier 100 contains at least two power supply wires and one or more signal wires, arranged in one or more layers. Pads 110 are electrically connected to the power supply and signal wiring.

Module 120 has an upper notch 122, a lower notch 124 and a cavity 125. Cavity 125 contains die 130. Die 130 is mechanically attached to the bottom of cavity 125. Die 130 is electrically connected to wires 140A and 140B by wirebonds 150A and 150B. Wire 140A steps down into upper notch 122. Wires 140A and 140B may be formed from copper or other conductive materials. Wirebonds 150A and 150B may be formed from gold, aluminum or other conductive materials.

Module 120 is electrically connected to carrier 100 by ball 160. Ball 160 is electrically connected to pad 110 by solder 170 and to wire 140A by solder 175. The lower notch of an upper module and the upper notch of a lower module cooperate to form a volume for receiving the ball, thus allowing for tighter packaging density of the modules. Cavity 125 may be filled with filler 180 to environmentally protect die 130 from contamination and handling damage.