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Clip and Spring Connected Multi-Module Carrier

IP.com Disclosure Number: IPCOM000004379D
Publication Date: 2000-Oct-19
Document File: 2 page(s) / 184K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a technique for packaging large number of devices in close proximity.

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This is the abbreviated version, containing approximately 76% of the total text.

Clip and Spring Connected Multi-Module Carrier

Packaging a large number of devices (chips) in close proximity has become feasible because of the low power dissipation and high reliability of CMOS technology. The close proximity of devices reduces propagation delays, which enables higher speed system operation. The low power dissipation enables dense packing of devices for small lightweight products, which can still be cooled by conventional means. Relatively low power semiconductor dice (chips) require minimum packaging. Disclosed is a technique for packaging large number of devices in close proximity.

Figure 1 is a cross section of a carrier/module assembly consisting of a carrier and one or more modules. Each module contains one or more semiconductor dice. The module is adapted to physically and electrically attach to the carrier.

Carrier 100 is composed of ceramic or organic insulating material and conductive wires. The wire may be formed from copper or other conductive materials. Carrier 100 contains at least two power supply wires and one or more signal wires, arranged in one or more layers. Pads 110A are electrically connected to the power supply and signal wiring. Upper clip 130 is electrically connected to pad 110A by solder 120A. Upper clip 130 is elastic and electrically conductive. Upper clip 130 may be formed from beryllium copper, or other elastic and electrically conductive materials. Pads 110B are electrically connected to a shielding wire, or ground plane, or decoupled power supply. Lower clip 132 is electrically isolated from upper clip 130 by insulator 134, and is electrically connected to pad 110B by solder 120B. Lower clip 132 is elastic and electrically conductive, and may be formed from beryllium copper, or other elastic and electrically conductive materials. Spring 136 is electrically connected to lower clip 132. Spring 136 may be formed from beryllium copper, or other elastic and electrically conductive materials.

Module 140 has a cavity 145 that contains die 150. Die 150 is mechanically attached to the bottom of cavity 145. Die 150 is electrically connected to wires 160A and 160B by wirebonds 170A and 170B. Wires 160A and 160B are contained within the module 140 insulator. Wire 160A is routed near an edge of module 140. Slot 180 in the module 140 insulator exposes a portion of wire 160A. Wire 160B is routed (not shown) near the same edge as wire 160A. Wire (or ground plane) 165 is contained within the module 140 insulator, and is below and in close proximity to wires 160A and 160B for purposes of electrical shielding. Wire 165 is typically connected to ground, or to a decoupled power supply connection. Electrical shielding reduces the inductance of wires 160A and 160B. A portion of wire 165 is brought to an edge of module 140 and exposed for purposes of electrical contact. Wires 160A, 160B and 165 may be formed from coppe...