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Solder Connected Multi-Module Carrier

IP.com Disclosure Number: IPCOM000004384D
Publication Date: 2000-Oct-23
Document File: 1 page(s) / 89K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a technique for packaging large number of devices in close proximity.

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Solder Connected Multi-Module Carrier

Packaging a large number of devices (chips) in close proximity has become feasible because of the low power dissipation and high reliability of CMOS technology. The close proximity of devices reduces propagation delays, which enables higher speed system operation. The low power dissipation enables dense packing of devices for small lightweight products, which can still be cooled by conventional means. Relatively low power semiconductor dice (chips) require minimum packaging. Disclosed is a technique for packaging large number of devices in close proximity.

Figure 1 is a cross section of a carrier/module assembly consisting of a carrier and one or more modules. Each module contains one or more semiconductor dice. The module is adapted to physically and electrically attach to the carrier.

Carrier 100 is composed of ceramic or organic insulating material and conductive wires. The wire may be formed from copper or other conductive materials. Carrier 100 contains at least two power supply wires and one or more signal wires, arranged in one or more layers. Pads 110 are electrically connected to the power supply and signal wiring. Pads 110 may be formed from a combination of metals such as chrome-copper-gold, and may include a solder dam, to receive a solder bump for electrical and mechanical connection.

Module 140 has a cavity 145 that contains die 150. Die 150 is mechanically attached to the bottom of cavity 145. Die 150 is electrically connected to wires 160A and 160B by wirebonds 170A and 170B. Wire 160A is routed to the edge of module 140 and connects to pad 165 that is attached to solder 120. Wire 160B is routed (not shown) to the same edge as wire 160A. Wires 160A and 160B may be formed from copper or other conductive materials. Wirebonds 170A and 170B may be formed from gold, aluminum, or other conductive materials.

Module 140 is electrically and mechanically connected to carrier 100 by solder 120. Cavity 145 may be filled with filler 180 to environmentally protect die 150 from contamination and handling damage.