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Solder Connected High-Performance Multi-Module Carrier

IP.com Disclosure Number: IPCOM000004386D
Publication Date: 2000-Oct-30
Document File: 2 page(s) / 116K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a technique for packaging large number of devices in close proximity.

This text was extracted from a RTF document.
This is the abbreviated version, containing approximately 100% of the total text.

Solder Connected High-Performance Multi-Module Carrier

Packaging a large number of devices (chips) in close proximity has become feasible because of the low power dissipation and high reliability of CMOS technology. The close proximity of devices reduces propagation delays, which enables higher speed system operation. The low power dissipation enables dense packing of devices for small lightweight products, which can still be cooled by conventional means. Relatively low power semiconductor dice (chips) require minimum packaging. Disclosed is a technique for packaging large number of devices in close proximity.

Figure 1 is a cross section of a carrier/module assembly consisting of a carrier and one or more modules. Each module contains one or more semiconductor dice. The module is adapted to physically and electrically attach to the carrier.

Carrier 100 is composed of ceramic or organic insulating material and conductive wires. The wire may be formed from copper or other conductive materials. Carrier 100 contains at least two power supply wires and one or more signal wires, arranged in one or more layers. Pads 110A are electrically connected to the power supply and signal wiring. Pads 110B are electrically connected to ground or to capacitively decoupled power supply wires (or planes). Pads 110A and pads 110B may be formed from a combination of metals such as chrome-copper-gold, and may include a solder dam, to receive a solder bump for electrical and mechanical connection.

Module 140 has a cavity 145 that contains die 150. Die 150 is mechanically attached to the bottom of cavity 145. Die 150 is electrically connected to wires 160A and 160B by wirebonds 170A and 170B. Wires 160A and 160B are contained within the module 140 insulator. Wire 160A is routed to an edge of module 140 and connects to pad 163A that is attached to solder 120A. Wire 160B is routed (not shown) the same edge as wire 160A. Wire (or ground plane) 165 is contained within the module 140 insulator, and is below and in close proximity to wires 160A and 160B for purposes of electrical shielding. Wire 165 is typically connected to ground, or to a capacitively decoupled power supply connection. Electrical shielding reduces the inductance of wires 160A and 160B. One end of wire 165 is brought to an edge of module 140 and connected to pad 163B that is attached to solder 120B. Wires 160A, 160B and 165 may be formed from copper or other conductive materials. Wirebonds 170A and 170B may be formed from gold, aluminum, or other conductive materials.

Module 140 is electrically and mechanically connected to carrier 100 by solder 120A and by solder 120B. Cavity 145 may be filled with filler 180 to environmentally protect die 150 from contamination and handling damage.