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Clip Connected Multi-Shielded-Module Carrier

IP.com Disclosure Number: IPCOM000004392D
Publication Date: 2000-Nov-02
Document File: 2 page(s) / 205K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a technique for packaging large number of devices in close proximity.

This text was extracted from a RTF document.
This is the abbreviated version, containing approximately 82% of the total text.

Clip Connected Multi-Shielded-Module Carrier

Packaging a large number of devices (chips) in close proximity has become feasible because of the low power dissipation and high reliability of CMOS technology. The close proximity of devices reduces propagation delays, which enables higher speed system operation. The low power dissipation enables dense packing of devices for small lightweight products, which can still be cooled by conventional means. Relatively low power semiconductor dice (chips) require minimum packaging. Disclosed is a technique for packaging large number of devices in close proximity.

Figure 1 is a cross section of a carrier/module assembly consisting of a carrier and one or more modules. Each module contains one or more semiconductor dice. The module is adapted to physically and electrically attach to the carrier.

Carrier 100 is composed of ceramic or organic insulating material and conductive wires. The wire may be formed from copper or other conductive materials. Carrier 100 contains at least two power supply wires and one or more signal wires, arranged in one or more layers. Pads 110A are electrically connected to the power supply and signal wiring. Clip 130 is electrically connected to pad 110A by solder 120A. Clip 130 is elastic and electrically conductive. Clip 130 may be formed from beryllium copper, or other elastic and electrically conductive materials. Pads 110B are electrically connected to a shielding wire, or ground plane, or decoupled power supply. Clip 135 is electrically connected to pad 110B by solder 120B. Clip 135 is elastic and electrically conductive. Clip 135 may be formed from beryllium copper, or other elastic and electrically conductive materials.

Module 140 has an upper step 142 and a cavity 145 that contains die 150. Die 150 is mechanically attached to the bottom of cavity 145. Die 150 is electrically connected to wires 160A and 160B by wirebonds 170A and 170B. Wires 160A and 160B are contained within the module 140 insulator. Wire 160A is routed near an edge of module 140. Step 142 in the module 140 insulator exposes a portion of wire 160A. Wire 160B is routed (not shown) near the same edge as wire 160A. Wire 160C is on the upper insulator surface of module 140 and is in close proximity to wires 160A and 160B for purposes of electrical shielding. Wire 160C is typically connected to ground, or to a decoupled power supply connection. Electrical shielding reduces the inductance of wires 160A and 160B. A portion of wire 160C is brought near an edge of module 140. Wires 160A, 160B and 160C may be formed from copper or other conductive materials. Wirebonds 170A and 170B may be formed from gold, aluminum, or other conductive materials.

Module 140 is electrically connected to carrier 100 by clip 130 and by clip 135. The upper edge of clip 130 is elastic and deforms slightly to accommodate module 140,...