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Clip Connected Multi-Module Carrier with Multi-Chip-Cavity Modules

IP.com Disclosure Number: IPCOM000004393D
Publication Date: 2000-Nov-03
Document File: 2 page(s) / 165K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a technique for packaging large number of devices in close proximity.

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Clip Connected Multi-Module Carrier with Multi-Chip-Cavity Modules

Packaging a large number of devices (chips) in close proximity has become feasible because of the low power dissipation and high reliability of CMOS technology. The close proximity of devices reduces propagation delays, which enables higher speed system operation. The low power dissipation enables dense packing of devices for small lightweight products, which can still be cooled by conventional means. Relatively low power semiconductor dice (chips) require minimum packaging. Disclosed is a technique for packaging large number of devices in close proximity.

Figure 1 is a cross section of a carrier/module assembly consisting of a carrier and one or more modules. Each module contains one or more semiconductor dice. The module is adapted to physically and electrically attach to the carrier.

Carrier 100 is composed of ceramic or organic insulating material and conductive wires. The wire may be formed from copper or other conductive materials. Carrier 100 contains at least two power supply wires and one or more signal wires, arranged in one or more layers. Pads 110A are electrically connected to the power supply and signal wiring. Upper clip 130 is electrically connected to pad 110A by solder 120A. Upper clip 130 is elastic and electrically conductive. Upper clip 130 may be formed from beryllium copper, or other elastic and electrically conductive materials. Pads 110B are electrically connected to the power supply or signal wire. Lower clip 132 is electrically isolated from upper clip 130 by insulator 134, and is electrically connected to pad 110B by solder 120B. Lower clip 132 is elastic and electrically conductive, and may be formed from beryllium copper, or other elastic and electrically conductive materials.

Module 140 has a cavity 145 that contains die 150. Die 150 is mechanically attached to the bottom of cavity 145. Die 150 is electrically connected to wires 160A and 160B by wirebonds 170A and 170B. Wires 160A and 160B are contained within the module 140 insulator. Wire 160A is routed near an edge of module 140. Slot 180 in the module 140 insulator exposes a portion of wire 160A. Wire 160B is routed (not shown) near the same edge as wire 160A. Module 140 has a cavity 147 that contains die 155. Die 155 is mechanically attached to the bottom of cavity 147. Die 155 is electrically connected to wires 165A and 165B by wirebonds 175A and 175B. Wires 165A and 165B are contained within the module 140 insulator. Wire 165A is routed near an edge of module 140. Slot 170 in the module 140 insulator exposes a portion of wire 165A. Wire 165B is routed (not shown) near the same edge as wire 165A. Wires 160A, 160B 165A and 165B may be formed from copper or other conductive materials. Wirebonds 170A, 170B, 175A, and 175B may be formed from gold, aluminum, or other conductive materials. Cavity 145 may be filled with filler 190 to environmentally protect die 150 from ...