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Use of a Plug Package Design for mounting semiconductors to circuit boards.

IP.com Disclosure Number: IPCOM000004596D
Publication Date: 2001-Feb-27
Document File: 1 page(s) / 38K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method of semiconductor component mounting using a die mounted into a plug fixture for insertion into a circuit board receptacle, which enables increased lateral component density from vertical space utilization, and multiple component mounting ability in the same vertical axis.

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Use of a Plug Package Design for mounting semiconductors to circuit boards.

A method of semiconductor component mounting using a die mounted into a plug fixture for insertion into a circuit board receptacle, which enables increased lateral component density from vertical space utilization, and multiple component mounting ability in the same vertical axis. Some examples using the concept are provided below: