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Internally Isolated Tape Packaging

IP.com Disclosure Number: IPCOM000004625D
Publication Date: 2001-Mar-01
Document File: 1 page(s) / 7K

Publishing Venue

The IP.com Prior Art Database

Abstract

This invention relates to semiconductor device packaging, and in particular to a package using the over molded isolation process incorporating an insulator between the die and the heat-sink, although it is applicable to other applications that require voltage isolation and high thermal transfer. The invention disclosed is the use of a tape or film to replace other means of isolation (such as a ceramic) between a semiconductor die and heat-sink. A tape or film with suitable properties for the application is used to attach the heat spreader (die flag) to the heat-sink.

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Internally Isolated Tape Packaging

This invention relates to semiconductor device packaging, and in particular to a package using the over molded isolation process incorporating an insulator between the die and the heat-sink, , although it is applicable to other applications that require voltage isolation and high thermal transfer

The invention disclosed is the use of a tape or film to replace other means of isolation (such as a ceramic) between a semiconductor die and heat-sink. A tape or film with suitable properties for the application is used to attach the heat spreader (die flag) to the heat-sink.

The tape properties in general should include high electrical isolation, handling durability, as well as good thermal conductance. Some examples of commercially available tape or film that could be used are KAPTON( with BN or Al2O3, or Al2O3 filled fiberglass tapes with pressure sensitive adhesive. Other selections could include but are not limited to- flame sprayed ceramics, pad printed epoxies, powder epoxy coatings, or transfer laminate B staged epoxies using cast ceramic materials.

The use of a tape or films over prior art solutions (such as ceramic substrates) reduces package costs, improves thermal transfer characteristics, enhanced electrical isolation, and allows the use of a common lead-frame to produce standard as well as electrically isolated products with a common molding process.