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A METHOD OF WIRE BONDING SEMICONDUCTOR DEVICES ON METAL FOIL OR TAPE CARRIERS

IP.com Disclosure Number: IPCOM000004652D
Publication Date: 2001-Mar-16
Document File: 1 page(s) / 72K

Publishing Venue

The IP.com Prior Art Database

Abstract

In order to increase package density on a given semiconductor lead frame/carrier, it is necessary to eliminate commonly used mechanical clamping mechanisms. By eliminating the space normally set aside for mechanical clamping systems on lead frame/carriers, additional packages can be built greatly improving utilization of space.

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A METHOD OF WIRE BONDING SEMICONDUCTOR DEVICES ON METAL FOIL OR TAPE CARRIERS

In order to increase package density on a given semiconductor lead frame/carrier, it is necessary to eliminate commonly used mechanical clamping mechanisms. By eliminating the space normally set aside for mechanical clamping systems on lead frame/carriers, additional packages can be built greatly improving utilization of space.

The method disclosed to eliminate typical mechanical clamping mechanisms (which use valuable space on the leadframe/carrier to effect the clamping action) is to replace mechanical clamping systems with a porous metal vacuum clamp. A vacuum clamp does not require space on the leadframe/carrier to be set aside to effect the clamping action (such as mechanical clamps) thus freeing up valuable space that can be used to pack more components. A vacuum clamp can be made of porous stainless steel (although other ferrous and non ferrous materials could be used) to act as a window clamp fixture. Another desirable property of porous metal vacuum clamps over mechanical clamping systems is the superior mating surface contact resulting from increased area dispersed forces that can improve the lead frame/carrier contact with the heater block adaptor improving overall bond quality. An example of the porous metal vacuum clamp concept as applied to a Shinkawa UTC-100 packaging tool is provided below.