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A unified design providing a processor thermal solution and mitigation of board vibration

IP.com Disclosure Number: IPCOM000004728D
Publication Date: 2001-Apr-23
Document File: 2 page(s) / 31K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a unified design providing a processor thermal solution and mitigation of board vibration. Benefits include improved heat-sink performance, increased effective board stiffening, and reduced vibration-induced board damage.

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A unified design providing a processor thermal solution and mitigation of board vibration

Disclosed is a unified design providing a processor thermal solution and mitigation of board vibration. Benefits include improved heat-sink performance, increased effective board stiffening, and reduced vibration-induced board damage.

A primary challenge regarding high-wattage microprocessors and chipsets is to provide effective thermal solutions. The most economical and feasible solutions utilize heat sinks. With power dissipations at the die reaching 130W, heat sinks are getting heavier and larger, leading to other problems such as vibration-induced damage. The large isolated mass of the heatsink on a processor or chipset may amplify the modal amplitudes considerably causing vibration-induced failures.

Conventionally, stiffening the board by using additional mounting holes/posts and edge stiffeners has severe limitations. These solutions are often unviable as they interfere with the circuitry on the board. Due to circuitry and space constraints, edge stiffeners may be located at a considerable distance from the location on the board requiring mitigation of the vibration induced modal response and rendering it ineffective. The disclosed design enhances the performance of a conventional heat sink and mitigates the vibration response of a motherboard by increasing effective board stiffness without requiring expensive or infeasible changes in layout.

Electronic packaging technology is increasing exponentially in terms of circuit density and number of I/Os. With such rapid growth in circuit technology, especially at the board level, a marked trend exists towards motherboard circuitry with short stub lengths. For example, close proximity between the chipsets and the microprocessor can greatly improve the electrical path between them, leading to faster and more efficient performance at the system level. The proposed invention exploits such a board layout where the microprocessor and a chipset are located close to each other. The proposed heat sink design is a modification of a conventional heat sink. Two conventional heat sinks are integrated into a single heat sink by incorporating a thermal-stiffener plate on the top.

The schematic illustration (see Figure 1) presents a typical scenario with different heights for the enabled processor and chipset package. The unified heat sink is attached to the die and board using conventional techniques. This design stiffens the motherboard over a considerably larger area than the area below the processor or chipset die alone, mitigating the modal amplitude of vibration. Also, the thermal-stiffener plate is relatively thin, so it does not increase the mass of the thermal solution considerably. However, the thickness of the plate may be tailored for a particular situation. Any effects of the increase in mass of the thermal solution are more than compensated ...