FLAT PACK/CHIP "CARRIER SOLDERLESS CONTACT" CONNECTOR
Original Publication Date: 1983-Mar-01
Included in the Prior Art Database: 2001-Oct-09
Richard R. Schweet: AUTHOR [+2]
AbstractThis article discusses a connector for interconnecting a chip carrier type device to a flexible or rigid substrate via a solderless, removable connector, while maintaining an extremely low profile.
:$,, MOTOROLA Technical Developments Volume 3 March 1983
FLAT PACK/CHIP CARRIER "SOLDERLESS CONTACT" CONNECTOR
By Richard R. Schweet and Gary M. Rapps
This article discusses a connector for interconnecting a chip carrier type device to a flexible or rigid substrate via a solderless, removable connector, while maintaining an extremely low profile.
The present industry state of the art for producing a removable semiconductor device utilizes a 'Dual lnline Package' which requires a .200 inch profile above the substrate, and requires that it be mounted on a rigid P.C. Board. The improved connector of Figure 1 provides for a profile of no higher than the chip carrier device itself which is typically ,075 inch. It can be mounted to printed circuit boards of various thickness or thin flex circuits.
The structure indicated in Figure 1 consists of a bottom brazed flat pack (1) with the leads cut a predetermined short length on all 4 sides. The flat pack is inserted into a window in the center of a
plastic molded frame (2), from the side with recesses for containing four extruded silicon rods (3). Into the frame are affixed four captive screws (4) which protrude through the substrate (5) and tighten Into a metal "nut" back up plate (6). The back up plate is insulated from the circuit runners of the substrate by a plastic film (7). When the structure is assembled, the silicone rods compress to a predetermined minimum contact for...