Browse Prior Art Database

PLASTIC CARRIER STRIP FOR NON-PLANER COMPONENTS

IP.com Disclosure Number: IPCOM000005527D
Original Publication Date: 1984-Apr-01
Included in the Prior Art Database: 2001-Oct-11
Document File: 2 page(s) / 59K

Publishing Venue

Motorola

Related People

Detlef Schmidt: AUTHOR

Abstract

Most automated pick and place equipment, to date, utilizes either a vacuum pick up nozzle for the handling of flat chipcomponentsoraspeciallydesigned mechanism for handling taped components with leads.

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MOTOROLA Technical Developments Volume4 April 1984

PLASTIC CARRIER STRIP FOR NON-PLANER COMPONENTS

by Detlef Schmidt

   Most automated pick and place equipment, to date, utilizes either a vacuum pick up nozzle for the handling of flat chipcomponentsoraspeciallydesigned mechanism for handling taped components with leads.

   Existing technology can only handle flat components automatically, when populating hybrid circuits, all other components, i.e., axially leaded, air wound coils, transistors, etc., must be placed with tweezers by hand.

   Shown below is a carrier strip, with a flat top, that has a molded or extruded contour to allow the component to be pressed into it or attached to it with a spot of adhesive. This assembly would provide a method that allows all types of components to be placed onto hybrid circuits automatically with the same vacuum placement stylus. Since approximately 30% of all components do not have a flat surface this method would greatly reduce the assembly labor by eliminating all manual placement.

!G Motorola, Inc. 1984 16

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MOTOROLA Technical Developments Volume4 April 1984

PLASTIC CARRIER

PRESSED IN COMPONENT

PLASTIC CARRlER

DIODE OR ANY AXIALLY LEADED COMPONENT

AIR WOUND COIL

SMALL SPOT OF ADHESIVE

PLASTIC OR PAPER STRIP

COIL ATACHED'WITH ADHESIVE

.E Motorola, Inc. 1984 17

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