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PARALLEL PRINTED CIRCUIT MANIFOLD

IP.com Disclosure Number: IPCOM000005641D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2001-Oct-23
Document File: 2 page(s) / 104K

Publishing Venue

Motorola

Related People

James A. Andrews: AUTHOR

Abstract

A parallel printed circuit manifold is an equipment design concept that relies on a dual plenum delivery and exhaust system which provides individualized inlet and exhaust ports used by fluid or gas to cool each component of a printed circuit board. When used in forced convection, a significant increase in heat removal capability per unit of fluid flow is obtained for board mounted packages without making restrictions on compo- nent design. This also has the potential of being retrofitted into existing parallel printed circuit board equip- ment designs without numerous tubes or restrictions on repairability.

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MO7OROLA Technical Developments Volume 7 October 1987

PARALLEL PRINTED CIRCUIT MANIFOLD

by James A. Andrews

   A parallel printed circuit manifold is an equipment design concept that relies on a dual plenum delivery and exhaust system which provides individualized inlet and exhaust ports used by fluid or gas to cool each component of a printed circuit board. When used in forced convection, a significant increase in heat removal capability per unit of fluid flow is obtained for board mounted packages without making restrictions on compo- nent design. This also has the potential of being retrofitted into existing parallel printed circuit board equip- ment designs without numerous tubes or restrictions on repairability.

   The objective here is to prevent mixing of inlet coolant with expended (heated) exhaust coolant. This removes limits on the allowable coolant temperature increase and obtains higher cooling capacity for a given rate of fluid flow. This design also provides remote ducting of hot fluids and exhaust noise which eliminates the need to dump noise and hot exhaust into a local equipment environment.

   A parallel printed circuit manifold array is shown in Figure 1. Each manifold's external form is a flat cover comprised of a moldable plastic or easily formed material that fits over the components on one side of a board. The manifolds thickness allows placement into the interboard gap that is normally provided between adjacent boards forventilation and electrical isolation. Each manifold is connected to a printed circuit board and is con- nected to the coolant delivery and exhaust system receptacles which can be located in a backplane.

   Internally, the manifold consists of two chambers separated by a wall of material and several smaller cool- ing chambers which are in contact with component heat transfer surfaces. In Figure 2, an adaptation of the manifold for gas cooling is presented. This manifold comprises top and bottom walls of plastic material as well as internal walls, also of a plastic material. Each of a large inlet plenum and outlet plenum extend over the surface of the...