Browse Prior Art Database

Method and apparatus for independent and optimized power interconnection between a component and a socket

IP.com Disclosure Number: IPCOM000005648D
Publication Date: 2001-Oct-23
Document File: 6 page(s) / 1K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method and apparatus for independent and optimized power interconnection between a component and a socket. Benefits include improved power delivery in terms of maximum capable current (power) and current transient response.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 49% of the total text.

Method and apparatus for independent and optimized power interconnection between a component and a socket

Disclosed is a method and apparatus for independent and optimized power interconnection between a component and a socket. Benefits include improved power delivery in terms of maximum capable current (power) and current transient response.

Background

              Demands on power delivery have increased as part of the effort to achieve higher performance in logic silicon products. Higher currents in addition to better current transient response and bypass capacitance are frequently the key parameters sought in successful power delivery design. One potential bottleneck in the delivery of power to the silicon is the component to socket interface. Of particular concern is the DC resistance (RDC) at this interface. Parasitic impedance must also be minimized.

              Conventionally, the same interconnect structure is used for both the power and signal connection even though the requirements for power and signaling can be different. Figure 1 gives an example of component/socket interconnection. The same pin structure is used repeatedly for both connections. The relatively low volume pin can limit current to the component. In addition, the high current density can result in excessive parasitic inductance. Better power delivery can often lead to more power/ground solder balls that can lead to excessively large packages. In addition, these power connections compete with much-needed I/O connections on the component.

Description

              The disclosed method employs large power connections for the power and ground interconnect. Figure 2 illustrates the idea of replacing individual power and ground pins to make larger interconnect structures. In this case, a blade similar to the one illustrated in Figure 3 replaces the pins. To minimize the impact of the blade on other design parameters, the blade width is generally the same as a pin. In addition, the pitch between blades and between blades and pins remain unchanged.  This consolidation enables the reduction of resistance by increasing contact surface area and contact forces. In addition, a larger cross-sectional area for conduction contributes to lower resistance.

              The blade design can be either surface or through-hole mounted to the component (or socket), as shown in Figures 4 and 5. Whatever the attach process, the blade height should be made as small as possible to minimize the bending moment exerted on the blade-package joint during socket insertion. Figure 6 shows the mating configuration. The blade’s mating companion consists of a series of broad forks that are pushed apart though the insertion of the blade.  The blade cross-section is tapered, as shown in Figures 3 through 5, to lower the necessary insertion force. Figure 3 also shows how the blade edge profile may also be tilted to further improve the insertion mechanical advantage and further lower the necessary insertion force.

Advantages

              The benefits of the apparatus in F...