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Method for shielding structures for high-speed differential signaling

IP.com Disclosure Number: IPCOM000005652D
Publication Date: 2001-Oct-23
Document File: 4 page(s) / 32K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for shielding structures for high-speed differential signaling. Benefits include improved bandwidth and improved routing capability

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Method for shielding structures for high-speed differential signaling

Disclosed is a method for shielding structures for high-speed differential signaling. Benefits include improved bandwidth and improved routing capability.

Background

              Differential crosstalk can occur between signal traces on integrated circuits with copper interconnects (see Figure 1). This problem is conventionally solved by increasing the spacing between adjacent differential pairs. This limits the routing capability that is extremely important for high-speed I/O applications. 

General description

      The disclosed method provides grounded structures grounded structure to effectively shield adjacent differential pairs and eliminate differential crosstalk. The disclosed method is applicable on all packaging/interposer/motherboard technology.

              Key elements of the disclosed method include:

·        Grounded trench that forms a good shield for eliminating differential crosstalk between signal traces (see Figure 2)

·        Grounded via array that forms a good shield for eliminating differential crosstalk between signal traces (see Figure 3)

      To fabricate grounded trenches, etch the trenches and fill with metal (see Figure 4).

      To fabricate grounded via arrays, add vias (see Figure 5).

Advantages

      The disclosed method provides several advantages over conventional methods. Reduced crosstalk results in higher signal transmission bandwidth. The disclosed method also can make the required spacing between adjacent differential pairs smal...