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Method for a twist heat-sink-to-package self-locking attachment

IP.com Disclosure Number: IPCOM000005654D
Publication Date: 2001-Oct-23
Document File: 3 page(s) / 112K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a twist heat-sink-to-package self-locking attachment. Benefits include simplified design and improved ease of field assembly, disassembly, and serviceability.

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Method for a twist heat-sink-to-package self-locking attachment

Disclosed is a method for a twist heat-sink-to-package self-locking attachment. Benefits include simplified design and improved ease of field assembly, disassembly, and serviceability.

Background

              Silicon designs increasingly require heat removal with larger and heavier heat sinks that must be attached to a processor. A separate retention module (RM) attaches to the motherboard to constrain the heat sink to the package (see Figure 1). Disadvantages of this conventional solution include:

·        Cost

·        Difficulty of assembly, often requiring skilled personnel

·        Special tools often required

·        Holes and accompanying keep-out areas to attach the RM

·        Separate RMs

Description

              The disclosed method is a technique to attach a heat sink to a lidded package without the use of a separate retention mechanism without any loss of thermal performance.

              Key elements of the method include:

·        Integrated heat sink (IHS) with 2-3 protruding nail-head locking features  (see Figure 2)

·        Heat sink with 2-3 grooves in the bottom plate to enable the features on the IHS to go through and lock when the heat sink is twisted while keeping the package/IHS fixed 

·        Reversible male and female mating parts. The IHS can have grooves and a heat sink bottom plate - nail heads, to mate with the grooves  (see Figure 3)

              The attachment holds the heat sink in place during shipping and operation.

Advantages

              The disclosed method provides several technical advantage...