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A METHOD AND APPARATUS FOR PLANARIZING ALUMINUM WITH AN ELECTRON BEAM GUN

IP.com Disclosure Number: IPCOM000005659D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2001-Oct-24
Document File: 1 page(s) / 39K

Publishing Venue

Motorola

Related People

Anthony Polito: AUTHOR

Abstract

The present invention discloses a new method for depositing and planarizing aluminum in submicron preohmics having aspect ratios of 1.0 or greater. Typically, electron beam evaporation methods using high rate electron beam guns and exotic planetaries or sputtering methods are used. However, because of the insuffi- cent mobility of the aluminum in these methods, cusping and extremely poor step coverage result.

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MOTOROLA Technical Developments Volume 7 October 1987

A METHOD AND APPARATUS FOR PLANARIZING ALUMINUM

WITH AN ELECTRON BEAM GUN

by Anthony Polite

   The present invention discloses a new method for depositing and planarizing aluminum in submicron preohmics having aspect ratios of 1.0 or greater. Typically, electron beam evaporation methods using high rate electron beam guns and exotic planetaries or sputtering methods are used. However, because of the insuffi- cent mobility of the aluminum in these methods, cusping and extremely poor step coverage result.

   It has been discovered that by depositing aluminum into submicron preohmics at normal incidence and using backside heating of the wafer to allow for aluminum mobility, much greater step coverage may be ob- tained. Rather than using rotating planetaries, both the wafer and electron beam gun are static during the process,

cl 0 - I.R. HEAT LAMPS (500' C)

WAFER -

L :LARIZED ALUMINUM

- Al VISCOUS CLOUD

\ - E-l3E4M GUN

0 Motorola, Inc. 1987 34

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