Browse Prior Art Database

SHIPPING RAIL HAVING CHAMFERS

IP.com Disclosure Number: IPCOM000005699D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2001-Oct-29
Document File: 1 page(s) / 48K

Publishing Venue

Motorola

Related People

S. C. Chow: AUTHOR [+2]

Abstract

The shipping rail described is an A-frame type transporting semiconductor devices, such as solder seal packages. Traditionally, shipping rails are constructed with flat inner surfaces which contact the package, par- ticularly the baseortopof the package. Because of the relative movement between shipping rail and packages, the antistatic solutions coating the shipping rail can be transferred to the packages, causing the packages to become discolored. In addition, this contact between the shipping rail and the package can result in enough friction to wear out the antistatic coating.

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MO7VROLA Technical Developments Volume 8 October 1988

SHIPPING RAIL HAVING CHAMFERS

by S. C. Chow and L. K. Cheng

   The shipping rail described is an A-frame type transporting semiconductor devices, such as solder seal packages. Traditionally, shipping rails are constructed with flat inner surfaces which contact the package, par- ticularly the baseortopof the package. Because of the relative movement between shipping rail and packages, the antistatic solutions coating the shipping rail can be transferred to the packages, causing the packages to become discolored. In addition, this contact between the shipping rail and the package can result in enough friction to wear out the antistatic coating.

   Because of these problems, Benstat rails, which are made of Polypropylene blended with antistatic material, are used. These rails are: three times as expensive; and cause stacking or binding of the packages due to soft- ness of the material.

   The accompanying figure illustrates a solution to these problems. A rail 10 is constructed with chamfers 11 at the upper corners and ridges 12 on the saddle. A typical device package 15 is illustrated by the dashed lines. The upper corners of package 15 engage chamfers 11 and prevent the upper surface of package 15 from contacting the surface of shipping rail 10. Ridges 12 engage the lower surface of package 15 and prevent the lower surface from contacting the surface of the saddle. This eliminates the extensive surface contact betwe...