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POST ASSEMBLY MULTI-LAYER INTERCONNECTS FOR FLEXIBLE CIRCUITS

IP.com Disclosure Number: IPCOM000005833D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-09
Document File: 2 page(s) / 77K

Publishing Venue

Motorola

Related People

Keith Soldner: AUTHOR [+2]

Abstract

Many electronic circuit applications require a degree of circuit connectivity that is impossible to achieve with a single layer of circuit traces. The conventional approach to obtaining this level of connectivity is the use of multi-layer circuits where multiple layers of circuit traces are sandwiched between insulating layers and connected to each other using a method such as plated thru holes. Implementation of this requires multiple executions of the circuit fabrication process plus the processes required to effect the interconnect between the metal layers (such as drilling and plating).

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MOTOROLA Technical Developments Volume 10 March 1990

POST ASSEMBLY MULTI-LAYER INTERCONNECTS FOR FLEXIBLE CIRCUITS

by Keith Soldner and Anthony Suppelsa

   Many electronic circuit applications require a degree of circuit connectivity that is impossible to achieve with a single layer of circuit traces. The conventional approach to obtaining this level of connectivity is the use of multi-layer circuits where multiple layers of circuit traces are sandwiched between insulating layers and connected to each other using a method such as plated thru holes. Implementation of this requires multiple executions of the circuit fabrication process plus the processes required to effect the interconnect between the metal layers (such as drilling and plating).

   For products that are manufactured on flexible circuits it is possible to achieve this type of connectivity from substrates with a single metal layer. The approach involves generating the traces for both metal layers of a two layer flexible circuit on the same side of the flexible substrate material (ref. Fig. 1). The electrical components are then attached to the circuit using conventional techniques (reflow or wave soldering). In addition to attaching the components to the circuit, the soldering process is used to deposit solder on pads which will form interconnect junctions between the two independent metal patterns, Upon completion of the component attach process, the flexible circuit is folded over on itself and a hea...