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Browse Prior Art Database

"PHERIPHERAL EDGE CONTACT IC PACKAGE" WITH OPTION II

IP.com Disclosure Number: IPCOM000005922D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-15
Document File: 2 page(s) / 76K

Publishing Venue

Motorola

Related People

Michael B. McShane: AUTHOR [+2]

Abstract

There are several desirable features related to high pin count IC packages such as low manufacturing cost, so&table and immunity to lead damage during handling, testing, burn in and board mounting. In order to achieve the above men- tioned features, plastic packages with peripheral edge contacts have been proposed and reduced to practice.

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MOTOROLA Technical Developments Volume 10 March 1990

"PHERIPHERAL EDGE CONTACT IC PACKAGE" WITH OPTION II

by Michael B. McShane and Paul T Lin

   There are several desirable features related to high pin count IC packages such as low manufacturing cost, so&table and immunity to lead damage during handling, testing, burn in and board mounting. In order to achieve the above men- tioned features, plastic packages with peripheral edge contacts have been proposed and reduced to practice.

   Conventional plastic transfer molding and metal lead frame technologies have been adopted to achieve an encap sulated plastic body. A unique, short, tightly wrapped lead configuration is used to create socketable edge contacts, figure 1. Specially designed matching socket contacts are used to insure an acceptable multi-insertable contact inter- connection. Contact resistances of high pin count packages after prolonged burn-in cycle have been measured and the results are demonstrated in figure 2.

   Since the lead length is short with very little extension beyond the plastic body, lead damage is minimized and practically eliminated. The short lead feature enhances the extension to very high density, fine pitch lead spacing. Con- ventional plastic packages use dam bar interconnects between adjacent leads. This new configuration simply shears and forms the leads without the need for dam bar interconnects.

   These expensive VLSI packages can easily be removed, retested, and resocketed without...