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DOUBLE LAYER RECESSED HYBRID FLIP CHIP ON BOARD

IP.com Disclosure Number: IPCOM000006032D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2001-Nov-27
Document File: 2 page(s) / 75K

Publishing Venue

Motorola

Related People

Marc Papageorge: AUTHOR [+3]

Abstract

A multilayer double sided metallized tape is used to place a Flip Chip device on one side and active or passive components on the other side for applications requiring high interconnect density substrates. The circuit provides near zero IC height profile and increases the use of automatic assembly operations.

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MOTOROLA Technical Developments Volume 11 October1990

DOUBLE LAYER RECESSED HYBRID FLIP CHIP ON BOARD

by Marc Papageorge, Francisco Alves and Bruce Freyman

   A multilayer double sided metallized tape is used to place a Flip Chip device on one side and active or passive components on the other side for applications requiring high interconnect density substrates. The circuit provides near zero IC height profile and increases the use of automatic assembly operations.

   Lead Bonding. The bonding operation of the internal interconnections is achieved by bonding the solder bumped die to the etched conductors on the tape by tack/reflow techniques. The bumped die is received from vendors using specified bumped metallurgy (PbSn, InPb, or Sn) for various bonding applications. After the die has been tested, the next level of operation is to excise the leaded hybrid module from the carrier tape. The leaded module is then transferred to the board in a way that precisely maintains the original relationship of the die with respect to its tape sprocket holes or to a vision system that positions leads to lands. Thus, the die will be accurately placed, die faced down into a routed or molded substrate. If desired (optional) some form of encapsulation (silicone or epoxy) may be used. The outer-lead bonding operation is then performed on all leads by either thermocompression, thermosonic, single point, reflow, or the use of z-axis conductive epoxies. The top side components are then...