Browse Prior Art Database

RF INTERCONNECT

IP.com Disclosure Number: IPCOM000006067D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2001-Nov-29
Document File: 1 page(s) / 44K

Publishing Venue

Motorola

Related People

Quah Tee Hoh: AUTHOR [+2]

Abstract

An RF interconnect 10 electrically connects a motherboard 11 to an RF pin 12. RF interconnect 10 is constructed from beryllium copper which is gold plated to ensure a good electrical connection. A pin shaped end 13 of RF interconnect 10 provides a pin joint with motherboard 11 which has a plated through hole to accept pin shaped end 13. A lateral support area 14 is incorporated into RF interconnect 10 to prevent any possible tilting thereof during assembly with motherboard 11.

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@ MOTOROLA INC.

Technical Developments Volume 12 April 1991

RF INTERCONNECT i

by Quah Tee Hoh and Lee Chee Aun i

  An RF interconnect 10 electrically connects a motherboard 11 to an RF pin 12. RF interconnect 10 is constructed from beryllium copper which is gold plated to ensure a good electrical connection. A pin shaped end 13 of RF interconnect 10 provides a pin joint with motherboard 11 which has a plated through hole to accept pin shaped end 13. A lateral support area 14 is incorporated into RF interconnect 10 to prevent any possible tilting thereof during assembly with motherboard 11.

soldered to ensure a positive mechanical and electrical connection.

  A flexible 2 shaped body connects pin shaped end 13 and forked end 15 toi provide flexibility between motherboard 11 and RF/pin 12. The design allows axial and vertical movement and minor lateral twisting, which greatly reduces solder breaking problems when subjedted to severe mechanical stresses such as drop tests. Also, the improved RF interconnect design protiides higher efficiency and

                                           - . A forked end 15 of RF interconnect 10 is faster cycle time. ~ constructed to be snapped on RF pin 12 and then

38 0 Motorola. 1°C. 1991

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