Browse Prior Art Database

USE OF COMPACT LIQUID TO AIR HEAT EXCHANGER SYSTEMS IN PC'S AND WORKSTATIONS

IP.com Disclosure Number: IPCOM000006078D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2001-Nov-30
Document File: 2 page(s) / 90K

Publishing Venue

Motorola

Related People

James A. Andrews: AUTHOR

Abstract

A compact liquid to air heat exchanger (LAHE) system is used to cool semiconductor packages in small movable personal computers and workstations. Referring to FIG. 1, the compact LAHE system components consist of: (1) a compact liquid to air heat exchanger core (tube and shell, tube and fin or plate and fin), (2) a fan which pushes cooling air through the heat exchanger fins, (3) and a pump which circulates a liquid cooling in a closed loop of tubing between cooling channels in the heat exchanger and heatsink channels in thermal contact with a heat dissipating electronic package, (4) a pressure control (relief) valve, (5) a liquid volume expansion chamber (either bellows or piston accumulator), and (6) an external housing to enclose the system in a compact self contained configuration. Thermoelectric cooler modules 6, detailed in FIG. 2, may optionally be used to chill the liquid coolant.

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MOTOROLA INC. Technical Developments Volume 12 April 1991

USE OF COMPACT LlQUlD.TO AIR HEAT EXCHANGER SYSTEMS IN PC'S AND WORKSTATIONS

by James A. Andrews

   A compact liquid to air heat exchanger (LAHE) system is used to cool semiconductor packages in small movable personal computers and workstations. Referring to FIG. 1, the compact LAHE system components consist of: (1) a compact liquid to air heat exchanger core (tube and shell, tube and fin or plate and fin), (2) a fan which pushes cooling air through the heat exchanger fins, (3) and a pump which circulates a liquid cooling in a closed loop of tubing between cooling channels in the heat exchanger and heatsink channels in thermal contact with a heat dissipating electronic package, (4) a pressure control (relief) valve, (5) a liquid volume expansion chamber (either bellows or piston accumulator), and (6) an external housing to enclose the system in a compact self contained configuration. Thermoelectric cooler modules 6, detailed in FIG. 2, may optionally be used to chill the liquid coolant.

  The system is filled with liquid coolant through an opening at the top-most location in the system. Then by partially compressing the expansion chamber, air pockets are removed as excess liquid is forced through the opening. With the expansion chamber compressed, the opening is sealed with no air trapped in the system. An electronic package dissipates heat into the liquid via a liquid cooled heatsink or cold plate. The liquid is pumped to a heat exchanger core where heat is removed from the liquid by air from a fan passing through fins in the heat exchanger core.

The cooled liquid is then recirculated by the pump back to the package heatsink to remove more heat. As the av...