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SURFACE MOUNTED HEATSINK

IP.com Disclosure Number: IPCOM000006137D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2001-Dec-06
Document File: 1 page(s) / 39K

Publishing Venue

Motorola

Related People

Dean C. Fisher: AUTHOR [+4]

Abstract

When an electronic circuit design needs a marginal improvement in its thermal performance, one solution is the addition of a small heatsink to dissipate the excess heat. One drawback to this solution is the added cost of the heatsink and the labor involved during manufacturing, especially for a manual assembly operation. This heatsink is designed for automated assembly to reduce the labor cost of manufacturing.

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MO7WROLA INC. Technical Developments Volume 12 April 1991

SURFACE MOUNTED HEATSINK

by Dean C. Fisher, Roy A. Stoppenbach, Randolph W. Scott and Brenda" F. Doorhy

  When an electronic circuit design needs a marginal improvement in its thermal performance, one solution is the addition of a small heatsink to dissipate the excess heat. One drawback to this solution is the added cost of the heatsink and the labor involved during manufacturing, especially for a manual assembly operation. This heatsink is designed for automated assembly to reduce the labor cost of manufacturing.

  Figure 1 shows one possible heatsink design that is compatible with pick-and-place machinery and solder reflow technology. The heatsink material would be extruded copper or plated aluminum that would be solderable. Heatsinks could be supplied either on tape and reel or in feeder tubes. The heatsink would be surface mounted and reflow

soldered to a printed circuit board pad that also will hold the surface mounted power device. The thermal conduction path would be from the device through the PCB pad to the heatsink.

Figure 1

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