Browse Prior Art Database

LOW PROFILE BACKPLANE INTERCONNECT

IP.com Disclosure Number: IPCOM000006258D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2001-Dec-19
Document File: 1 page(s) / 49K

Publishing Venue

Motorola

Related People

Raul Olivera: AUTHOR

Abstract

As the thrust towards miniaturization continues, the thermal density of electronic equipment will con- tinue to increase. There is also a need to stack equip- ment to minimize the use of space. In these cases, it is desirable to direct the airflow from front to back; otherwise the rising hot air will overheat the top units in the stack.

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MOTOROLA /NC. Technical Developments Volume 14 December 1991

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LOW PROFILE BACKPLANE INTERCONNECT

by Raul Olivera

  As the thrust towards miniaturization continues, the thermal density of electronic equipment will con- tinue to increase. There is also a need to stack equip- ment to minimize the use of space. In these cases, it is desirable to direct the airflow from front to back; otherwise the rising hot air will overheat the top units in the stack.

  In cases where a modular card cage approach is used, a large backplane board ("mother board") is nor- mally used to make the large number of connections that are usually needed. The problem with this approach is that the backplane board will block most of the air- flow that needs to exit through the rear.

A solution to the problem would be to use a low profile interconnect approach as described below:

  In applications where the modules are individual housings, card edge connectors are mounted on the back of the module, stacked in a horizontal orientation (see figure 1). PCB strips mounted in a horizontal orientation are used to make the connections between the modules. Several of the PCB strips could be stacked or staggered to minimize the vertical profile (see figure 2).

  This interconnect scheme can make a large number of connections and is very flexible; the PCb strips can be snapped in as needed.

STACKED PCS STRIPS STAGGERED PCBSTRIPS

26 0 MO,orOla. 1°C. 1991

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