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Method for DC shunts for high-current bypassing and high I/O applications

IP.com Disclosure Number: IPCOM000006265D
Publication Date: 2001-Dec-19
Document File: 7 page(s) / 1K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for DC shunts for high-current bypassing and high I/O applications. Benefits include improved current dissipation and improved processor reliability.

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Method for DC shunts for high-current bypassing and high I/O applications

Disclosed is a method for DC shunts for high-current bypassing and high I/O applications. Benefits include improved current dissipation and improved processor reliability.

Background

              As processors increase in frequency and speed, they require increasing amounts of power. As the amount of power increases, the area for carrying the current through the socket is decreased.

      High current through sockets requires low resistance and low power dissipation. Higher power dissipation in the socket results in higher socket temperatures. Power dissipation may be computed using the following equation: Power = Current2 x Resistance.

              To supply the required current, the number of socket pins is increased (see Figure 1), which lowers the total resistance and results in a lower power dissipation. This situation is costly not only in terms of dollars for the extra pins but also in terms of surface area.

      If the number of pins added for power dissipation does not provide a much lower resistance than the resistance of the pins in the core region, the effectiveness of the additional pins may not sufficiently reduce the current flowing through one region of the package. In other words, additional pins must provide an effective DC shunt.

General description

              The disclosed method is for shunt designs for high DC-current bypassing and high I/O applications. This approach can potentially release many socket pins for I/O applications. The method utilizes conventional socket design without changes.

              The key elements of the method include:

·        Pieces of metal mounted beside a socket to provide shunts for high DC current flow

·        Edge designs of a package or an Interposer for new DC shunts from inventors

·        Bulk metal and screws that mechanically support the package and the interposer

·        Various shunt designs that provide either low inductance or low cost solutions

Advantages

              The disclosed method provides DC shunts that provide a path for 90% of the total current. This approach moves the DC current away fr...