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Method for a socket with added solder materials for load bearing

IP.com Disclosure Number: IPCOM000006270D
Publication Date: 2001-Dec-19
Document File: 3 page(s) / 1K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a socket with added solder materials for load bearing. Benefits include increased support area and decreased load stress per solder sphere and socket housing area.

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Method for a socket with added solder materials for load bearing

Disclosed is a method for a socket with added solder materials for load bearing. Benefits include increased support area and decreased load stress per solder sphere and socket housing area.

Background

              The disclosed method addresses the problem of equalizing large loads over the entire socket. Conventionally, this problem is solved by adding glue or adhesive to the socket and processor board or adding a fixture to be removed after reflow (see Figure 1).

Description

              The disclosed method is a surface mounted socket for electronics with added solder material and pads on the socket (see Figure 2). Key elements include added solder material and pads on the socket for load bearing of the heat sink and thermal interface materials.

Advantages

              The disclosed method provides several technical advantages over the conventional solution. 

·        An increase in the support area reduces the load stress per solder sphere and socket housing area.

·        The structural strength of the socket is not reduced.

·        Additional room is not required on the processor board because this area is covered by the socket already.

·        Board fabrication does not encounter significant problems because boards have pads in this general area already.

·        Added solder spheres to support load on the socket are easy to design and manufacture because solder spheres or paste are a typical way of mounting sockets and pads on processor boards are required as part of the pro...