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Method for LIF pin alignment during SMT soldering

IP.com Disclosure Number: IPCOM000006272D
Publication Date: 2001-Dec-19
Document File: 3 page(s) / 213K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for low insertion force (LIF) pin alignment during surface-mount technology (SMT) soldering. Benefits include improved LIF socket pin alignment during SMT soldering and improved quality due to reduced solder joint fracture.

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Method for LIF pin alignment during SMT soldering

Disclosed is a method for low insertion force (LIF) pin alignment during surface-mount technology (SMT) soldering. Benefits include improved LIF socket pin alignment during SMT soldering and improved quality due to reduced solder joint fracture.

Background

      The disclosed method addresses the problem of potential misalignment of LIF socket pins during reflow. Conventionally, this problem is solved by forcing LIF socket pin alignment during processor insertion (see Figure 1). The results sometimes include solder joint fracture.

General description

              The disclosed method is a LIF socket SMT soldering process improvement that uses mated pin fields to ensure LIF socket pin alignment. The key element is the use of the pin field for alignment during soldering.

Advantages

              The disclosed method presents several technical advantages over the conventional solution.

·        Reduction of CPU insertion force and potential solder joint cracks

·        Tightly fitting pins in the LIF socket forces alignment during reflow.

·        The custom metal pin field can be supplied by multiple sources.

Detailed description

              The disclosed method is a process of SMT soldering of LIF sockets. A pin field is inserted to the LIF socket prior to SMT soldering (see Figure 2). The engagement of the pin field and the LIF socket ensures true positioning during soldering. After SMT soldering, the pin field is removed from the socket and reused (see Figure 3 for the top view of the pin...