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Method for an integrated heat spreader design with pre-attached mechanical sealant, thermal interface material, and clips

IP.com Disclosure Number: IPCOM000006278D
Publication Date: 2001-Dec-19
Document File: 4 page(s) / 44K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is an integrated heat spreader design with pre-attached mechanical sealant, thermal interface material (TIM), and clips. Benefits include improved thermal performance and reduced requirement for manufacturing equipment for the integrated heat spreader (IHS) process.

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Method for an integrated heat spreader design with pre-attached mechanical sealant, thermal interface material, and clips

Background

The IHS is conventionally attached to the die with the following process steps (see Figure 1):

·        Dispensing sealant onto the substrate

·        Dispensing flux onto the die

·        Picking and placing a solder preform onto the die

·        Dispensing flux onto the solder perform

·        Placing the IHS and clip on top of the die

·        Reflowing the thermal interface solder

·        Curing the sealant adhesive

·        Removing the spring clip

Description

Disclosed is an integrated heat spreader design with pre-attached mechanical sealant, thermal interface material (TIM), and clips. Benefits include improved thermal performance and reduced requirement for manufacturing equipment for the integrated heat spreader (IHS) process.

The disclosed method is an IHS with pre-attached sealant adhesive, TIM, and clips (see Figure 2). The pre-attached sealant adhesive and thermal interface materials may include but are not limited to B-stage polymers, phase change polymers, thermo-plastics, or solder alloys. These materials are attached to the heat spreader prior to assembly on the semiconductor package. By attaching the clips sealant and solder to the IHS prior to package assembly, these tools can be eliminated and assembly costs can be reduced (see Figure 3).

The key elements of the method include:

·        Heat spreader with solder thermal interface material attached by a liquid solder dispenser, reflowe...