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Method for an integrated heat spreader design with a pre-attached sealant pre-form

IP.com Disclosure Number: IPCOM000006280D
Publication Date: 2001-Dec-19
Document File: 3 page(s) / 52K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated heat spreader (IHS) design with pre-attached sealant pre-form. Benefits include improved process capability.

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Method for an integrated heat spreader design with a pre-attached sealant pre-form

Disclosed is a method for an integrated heat spreader (IHS) design with pre-attached sealant pre-form. Benefits include improved process capability.

Background

              Sealants are required to reduce mechanical loading on the thermal interface material and to maintain adhesion of the IHS to the package during thermal cycling. Sealant-dispense tools reduce overall assembly line utilization and increase assembly cost.

              The IHS is conventionally sealed to the package during the following steps:

              1.           Dispensing a polymer sealant onto the package
2.           Picking and placing the IHS

              3.           Clip the IHS on top of the package
4.           Curing the sealant

General description

      The disclosed method is an integrated heat spreader (IHS) with pre-attached sealant for bonding the spreader to the package. The sealant may be a solder or phase-change polymer material film or pre-form, depending on the package requirements. The sealant maintains adhesion of the IHS to the package by bonding the peripheral lip of the IHS to the package.

      The key elements of the method include:

·        Integrated heat spreader with solder or phase change polymer sealant pre-form attached to the bottom periphery of the IHS

·        For solder sealant, a Cu bonding ring on the package is required so that the solder can bond to the package

-         The IHS with pre-attached sealant eliminates the need for sealant dispensing, improving process capability for sealant weight, width, and placement, increasing attach link machine utilization, and increasing IHS attach yield due to control of the sealant perform or film thickness and dimensions.

-         A solder sealant may eliminate the need for a vent hole from the cavity to the top surface of the IHS. The vent hole i...