Browse Prior Art Database

C5 SOLDER BALL VISION INSPECTION

IP.com Disclosure Number: IPCOM000006302D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2001-Dec-21
Document File: 2 page(s) / 127K

Publishing Venue

Motorola

Related People

Gary Blitman: AUTHOR [+3]

Abstract

As Motorola products become smaller, many design- ers are incorporating CS chip carriers into their prod- ucts in order to save valuable pc board space. The accuracy ofthe CS placement and mechanical reliability of C5 components are critical because post placement inspection requires either the use of expensive X-ray technology or the use of destructive inspection meth- ods, both of which increase the cost of manufacturing.

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MOTOROLA /NC. Technical Developments Volume 14 December 1991

C5 SOLDER BALL VISION INSPECTION

by Gary Blitman, Jerry Pine, Ken Wasko

  As Motorola products become smaller, many design- ers are incorporating CS chip carriers into their prod- ucts in order to save valuable pc board space. The accuracy ofthe CS placement and mechanical reliability of C5 components are critical because post placement inspection requires either the use of expensive X-ray technology or the use of destructive inspection meth- ods, both of which increase the cost of manufacturing.

  At the Boynton Beach facility, the equipment engi- neering group is placing these components with vision guidance using IGOPPS. An in-line vision inspection algorithm was developed that fmds the center and ori- entation of the C5 chip carriers and examines all solder balls to determine presence/absence of each ball and its placement relative to the C5 chip carrier fiducial mark- ings. If any solder balls are out of the required spec or missing completely, the C5 chip carrier is not placed. This has greatly reduced defects resulting from solder balls missing pads.

  The algorithm developed uses the edges of the com- ponent and the artwork fiducials to calculate an expected position of the solder ball array. A profile vector is gen- erated for each row/column of the array to intercept the centers of the anticipated solder ball position. By per- forming a transition analysis along each vector it is pos- sible to...