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Method for a PC-chassis design with an enclosed TEC﷓cooled module

IP.com Disclosure Number: IPCOM000006373D
Publication Date: 2001-Dec-28
Document File: 8 page(s) / 183K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a PC-chassis design with an enclosed TEC-cooled module. Benefits include improved temperature reduction.

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Method for a PC-chassis design with an enclosed TEC‐cooled module

Disclosed is a method for a PC-chassis design with an enclosed TEC-cooled module. Benefits include improved temperature reduction.

Background

              The conventional PC-chassis design, shown in Figure 1, utilizes the external ambient air to cool the IC device. The typical external ambient temperature ranges from 25-35º C. When the ambient air enters the chassis, the air is usually pre‐heated by the surrounding components before the air reaches the IC device that requires cooling. The pre‐heating effects bring the air up to 45‐55º C before the air enters the IC cooling solution. Under this situation, the IC cooling solution needs to be designed based on an equivalent ambient air as high as 55º C. It must be noted that the IC device operation temperature can be lowered by 1º C for every 1º C reduction of the ambient air temperature when the same IC cooling solution is used. A good PC-chassis design avoids pre‐heating and lowers the temperature of air entering the cooling solution as much as possible.

              The conventional state-of-the-art design, shown in Figure 2, utilizes a fan duct to bring the external ambient air directly to the IC cooling solution such that the pre‐heating effects by the surrounding components can be minimized. However, the temperature of air entering the cooling solution is still gated by the external ambient temperature. The lowest air temperature achieved by the conventional state-of-the-art PC-chassis design is the same as the external ambient temperature.

General description

              The disclosed method is a PC-chassis design features a sub‐ambient environment around the IC cooling solution so that the IC device can be operated at a much lower temperature than that in the traditional PC chassis.

              The key elements of the method include the following:

·        PC-chassis design with a thermally insulated module

·        IC cooling solution such as a fan heatsink and a TEC cooling assembly (or equivalent refrigeration system) as part of the thermally insulated module

Advantages

              The disclosed method can lower the air temperature near the IC device even below the external ambient temperature so that the IC device can be operated at a much lower temperature than that in the conventional PC chassis. In addition, a high‐performance fan with high noise level can be implemented in this method due to the excellent sound insulation of the module.

              The advantages of the new PC-chassis design include:

·        The thermal insulated box is maintained at a sub‐ambient temperature so that the IC device can be maintained at a much lower operation temperature than that operated in a regular room‐temperature environment.

·        The heat generated by the IC device and the TEC assembly is directly dissipated to the external of the PC chassis without affecting the other components inside the same PC chassis.

·        The high heat flux generated by the IC device can be spread out by the heatsink mounted on the IC device and subs...