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Method for a graphite drop-in-heat spreader

IP.com Disclosure Number: IPCOM000006376D
Publication Date: 2001-Dec-28
Document File: 1 page(s) / 1K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a graphite drop-in-heat spreader. Benefits include improved thermal conductivity and improved reliability.

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Method for a graphite drop-in-heat spreader

Disclosed is a method for a graphite drop-in-heat spreader. Benefits include improved thermal conductivity and improved reliability.

Description

              The disclosed method is a drop-in heat spreader (GDHS) that utilizes a graphite material instead of a copper slug that is utilized in the conventional GDHS (see Figure 1). The Graphite material is placed inside of the mold­ cap of a chipset package approximately 0.010inch above the die. The GDHS provides a highly thermally conductive path for the heat produced by the die to spread (dissipate) horizontally throughout the package, reducing the die case temperature (Tc), extending the life of the part, and extending the life of a battery of a laptop computer.

Advantages

              The Graphite DHS has a conductivity of 460 W/mK in the in‐plane dimension and a material of 1.3 g/cm3. These material properties translate into a specific thermal conductivity of 0.345 W0m2/kg 0K which is approximately 5.1 and 7.6 times higher than aluminum 6061 and pure copper, respectively. This high specific thermal conductivity translates into a lower die junction temperature, increasing the reliability of the part.

Fig. 1

Disclosed anonymously