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Method for reduced evaporation thermal resistance of heat pipe by using stepped wall/wick thickness in an evaporative heat transfer section

IP.com Disclosure Number: IPCOM000006384D
Publication Date: 2001-Dec-28
Document File: 4 page(s) / 198K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for reduced evaporation thermal resistance of heat pipe by using stepped wall/wick thickness in an evaporative heat transfer section. Benefits include improved cooling.

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Method for reduced evaporation thermal resistance of heat pipe by using stepped wall/wick thickness in an evaporative heat transfer section

Disclosed is a method for reduced evaporation thermal resistance of heat pipe by using stepped wall/wick thickness in an evaporative heat transfer section. Benefits include improved cooling.

Background

              For the cooling of high heat-flux electronic devices, use of a heat pipe is widely considered, which enhances heat spreading along its length. To maximize thermal performance of the heat pipe, every component of the total thermal resistance should be optimized. One of the key thermal resistances is the evaporation resistance, which occurs in evaporative region of the heat pipe.

              Evaporation resistance combines phase-change resistance and conduction resistance through the heat pipe wick thickness. 

              For all of the existing heat pipe designs, a uniform wick thickness is used throughout the whole heat pipe length.  However, it is known that the minimum wick thickness is preferable for evaporative thermal resistance, as long as the capillary pumping capability of the wick thickness is assured for the design power. In addition, in evaporative region of the heat pipe, thicker copper wall thickness is preferable, which helps spread heat, and hence, extend evaporative heat transfer area.

Description

              The disclosed method utilizes different wall/wick thickness between the evaporative region and the other section of the heat pipes (see Figures 1, 2, and...