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Browse Prior Art Database

SOLDER CAPILLARY PRESSURE RELIEF CRYSTAL INSULATOR

IP.com Disclosure Number: IPCOM000006451D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2002-Jan-04
Document File: 1 page(s) / 77K

Publishing Venue

Motorola

Related People

Jay Anzelmo: AUTHOR [+3]

Abstract

Current crystal insulator designs, while serving the purpose of protecting components horn solder flow, have prevented optimum performance during lead-through- hole solder wetting. These insulators tend to trap gases within the plated-through-hole, therefore preventing sol- der from properly wetting the component lead and hole wall. This entrapment subsequently results in insutkiently soldered and unsoldered components.

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MOTOROLA INC. Technical Developments Volume 15 May 1992

SOLDER CAPILLARY PRESSURE ~

RELIEF CRYSTAL INSULATOR

by Jay Anzelmo, Kevin Kent, and Rudy Mendo+

PROBLEM

  Current crystal insulator designs, while serving the purpose of protecting components horn solder flow, have prevented optimum performance during lead-through- hole solder wetting. These insulators tend to trap gases within the plated-through-hole, therefore preventing sol- der from properly wetting the component lead and hole wall. This entrapment subsequently results in insutkiently soldered and unsoldered components.

SOLUTION

  The Solder Capillary Pressure Relief Crystal Insu- lator capitalizes on a gas relief design that provides an escape channel for forming gases. This process of gas relief permits proper solder capillary action and compo- nent wetting.

  The insulator design, as seen in the figure below, provides many significant improvements over the for- mer design. The upper and lower channels along the length of the component allow for gas relief to the sur-

rounding environment. Th< standoffs perform two major functions-they support the component body and help stabilize the crystal over the solder wave; they also pro- vide an insulation barrier [between the board and the component body. The center webbing also acts as a bar- rier between the wicking solder and the component base. It separates the componetit leads, therefore preventing the formation of solder shdits.

  Another special feature of...