Browse Prior Art Database

LOW PROFILE IC PACKAGING METHOD

IP.com Disclosure Number: IPCOM000006473D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2002-Jan-07
Document File: 1 page(s) / 53K

Publishing Venue

Motorola

Related People

Leonard Morton Lehrer: AUTHOR [+2]

Abstract

When a new customer reviews a portable radio, cape- If a cutout were provided in the last or last two outer cially when being compared to competitive products, layers, high profile components of height h, could be the first feature noticed is size. It is vital that Motorola selectively placed within these pockets (see Figure 21, maintains its competitive edge in all areas including the thus reducing the impact of their physical size. volume/size of the product.

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MOTOROLA INC. Technical Developments Volume 15 May 1992

LOW PROFILE IC PACKAGING METHQD

by Leonard Morton Lehrer and Peter Bradford Gilm~ore

  When a new customer reviews a portable radio, cape- If a cutout were provided in the last or last two outer cially when being compared to competitive products, layers, high profile components of height h, could be the first feature noticed is size. It is vital that Motorola selectively placed within these pockets (see Figure 21, maintains its competitive edge in all areas including the thus reducing the impact of their physical size. volume/size of the product.

  One aspect of radio mechanical design which directly impacts the volume is the overall component height of packaged ICs. There are two ways to reduce component height, 1) reduce the thickness of the packaged die, or 2) place the component so that it sits lower with respect to the surface of the Printed Circuit board. This paper addresses an idea to place a component with minimal effect on overall height.

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  A typical portable radio uses PC boards which are Based on a dielectric thickness of d the overall height constructed of 6 to 8 layers. Normally, components are reduction is h-d (neglecting~effect of missing prepreg). If placed on the outer surfaces of the first and last layers this process were performed across two layers of die- (see Fire 1). lectric the savings could amount to .025.

In order to achieve this reduction, the i...