Browse Prior Art Database

SOLDER EMBOSSED PCB LOCATION FOR DEBOSSED COMPONENT

IP.com Disclosure Number: IPCOM000006544D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2002-Jan-14
Document File: 2 page(s) / 69K

Publishing Venue

Motorola

Related People

Alien David Hertz: AUTHOR [+3]

Abstract

Component substrates such as PGA and flat packs are normally aligned by vision and placed on wet solder paste which has been screen printed or stenciled on a PC board. The location of the component can be dis- turbed while the assembly is in transit from the point of placement through subsequent operations and reflow.

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MOTOROLA INC. Technical Developments Volume 16

August 1992

SOLDER EMBOSSED PCB LOCATION

FORDEBOSSEDCOMPONENT

by Alien David Hertz, David Alan Tribbey and Kenneth Cook

  Component substrates such as PGA and flat packs are normally aligned by vision and placed on wet solder paste which has been screen printed or stenciled on a PC board. The location of the component can be dis- turbed while the assembly is in transit from the point of placement through subsequent operations and reflow.

  The trauma of transport can be minimized by effecting positive location and retention of the compo- nent to the printed circuit board. This marriage of the component and substrate can provide immunity to nor- mal shock and movement of the assembly during con- veyor line transit through reflow.

  An improved process for the placement of a com- ponent utilizes pad areas debossed or formed with a spherical concavity (generated through etching, machin- ing, molding, laser beam action or other means) onto a PC board or substrate which has had a conductor previously applied. The application of the conductor can be by plating; printing and reflowing; or, laser deposition.

  This process enhances the transport of the chip carrier-PC board assembly from point of placement through subsequent operations until permanently attached in reflow.

LQ Motorola, 1°C. 199.2 89

[This page contains 14 pictures or other non-text objects]

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MOTOROLA INC. Technical Developments Volume 15 August 1992

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