Browse Prior Art Database

SURFACE MOUNT LAMP TERMINATION ATTACHMENT PROCESS

IP.com Disclosure Number: IPCOM000006562D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2002-Jan-15
Document File: 2 page(s) / 76K

Publishing Venue

Motorola

Related People

Ed Klaczak: AUTHOR

Abstract

Liquid Crystal Display backlighting is economically achieved thm incandescent lamps. Leaded lamps have the disadvantage of laborious handsoldering. Surface Mount Technology (S.M.T) fused lamp technology can be robotically placed, then reflow soldered, reducing total labor costs.

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MOZOROLA INC. Technical Developments Volume 16

August 1992

SURFACE MOUNT LAMP TERMINATION ATTACHMENT PROCESS

by Ed Klaczak

ABSTRACT

  Liquid Crystal Display backlighting is economically achieved thm incandescent lamps. Leaded lamps have the disadvantage of laborious handsoldering. Surface Mount Technology (S.M.T) fused lamp technology can be robotically placed, then reflow soldered, reducing total labor costs.

This concept simplifies the process for creating a
S.M.T. fused lamp solderable termination by greatly reducing material and processing steps of the current design.

DESCRIPTION

  The current S.M.lY fused lamp end-cap termination attachment is accomplished by using an open end metal sleeve, feeding the wire termination through the sleeve, soldering the wire to the outside of the sleeve and backtIlling the sleeve/lamp interface with RTV silicon, as per Figure 1.

There are a total of six process steps involved in this

kind of construction, as per Figure 2. This construction

lends to problems, either excess RTV on the end-cap solder area causing solderability issues or interference of the edge of the metal end-cap to the glass causing breakage.

  The improved lamp assembly method, as per Fig- ure 3, takes existing (fued glass bead seal) leaded lamp technology and further processes the external lead as follows:

  The external lead is wrapped around the glass enve- lope with wire winding equipment or similar. The lamp and wrapped lead are dipped into a conductive adhesiv...