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Method for alignment between a socket and a package

IP.com Disclosure Number: IPCOM000006570D
Publication Date: 2002-Jan-15
Document File: 3 page(s) / 52K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for alignment between a socket and a package. Benefits include improved quality, improved throughput, and reduced damage.

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Method for alignment between a socket and a package

Disclosed is a method for alignment between a socket and a package. Benefits include improved quality, improved throughput, and reduced damage.

Background

              Conventional package assembly requires a human operator. An electronic package (with a pre-attached heatsink) or socket may be damaged when an assembly operator is unable to see the two components and misalignment occurs. Difficulty may occur even when the operator is able to see the two components because of the tight pin pitch (.05") and great number of pins (700).

              The problem is conventionally unsolved. A high failure rate occurs from bent pins. Misalignment occurs because the package is assembled to the socket manually by line of sight. In one other case, alignment of the package to the socket is achieved through features on the heatsink, cartridge, or additional components (See Figure 1).

General description

              The disclosed method uses alignment features on a socket and an electronic package that enable the package to be inserted into the electronic package blindly without misalignment of the package pins to the socket holes.

              The key elements of the method include the following:

•             Keys on the socket cover of sufficient height to prevent pin engagement until they are aligned

•             Keyways on the electronic package's interposer

Advantages

              The disclosed method provides several advantages over the conventional solution, including:

•             Placing alignment features on the two mating components enables the lowest amount of tolerance stackup for the tightest possible alignment

•             Electronic package pins or socket cannot be engaged until fully aligned

•             No additional piece parts are involved in the solution

•             Precision alignment supports the possibility of automated package assembly to the socket

              The blind‐mating features were machined into the socket and package and assembled to test the concept (18 units total). All of...