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Method for a universal inspection and measuring jig

IP.com Disclosure Number: IPCOM000006612D
Publication Date: 2002-Jan-16
Document File: 5 page(s) / 301K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a universal inspection and measuring jig. Benefits include reduction of die placement problems and inaccurate measurement data that sometimes occurred from handling the substrate and improved throughput.

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Method for a universal inspection and measuring jig

Disclosed is a method for a universal inspection and measuring jig. Benefits include reduction of die placement problems and inaccurate measurement data that sometimes occurred from handling the substrate and improved throughput.

Background

              A conventional inspection jig does not have a vacuum hole (see Figure 1).

              A substrate is manually removed from the output magazine using a tweezers (see Figure 2).

              The substrate is manually transported by the operator, from the inspection jig to the measuring jig, which sometimes causes die placement problems and inaccurate measurement data (see Figure 3).

Description

              The disclosed method is a modified inspection and measuring jig. The inspection jig contains a vacuum hole. The measuring side of the jig has a suction cup on top.

              To use the jig, perform the following steps:

1.           Take one substrate from the output magazine using a tweezers.

2.           Place the strip to the modified inspection jig that has vacuum hole (see Figures 4 and 7).

3.           Place the modified inspection jig with the substrate to be measure onto the modified               measuring jig with the suction cup on top  (see Figure 5).
4.           Activate the vacuum so that the substrate on top of the inspection jig with vacuum hole is                    sucked by the suction cup installed in the measuring jig  (see Figures 6 and 8).

Advantages

              An advantage of the disclosed method is that it eliminates handling the substrate and prevents the die placement problems and inaccurate...