Browse Prior Art Database

Method for a CPU/IHS snap-in frame

IP.com Disclosure Number: IPCOM000006617D
Publication Date: 2002-Jan-16
Document File: 3 page(s) / 86K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a CPU/integrated heat spreader (HIS) snap-in frame. Benefits include improved performance, increased capacity, and improved productivity.

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Method for a CPU/IHS snap-in frame

Disclosed is a method for a CPU/integrated heat spreader (HIS) snap-in frame. Benefits include improved performance, increased capacity, and improved productivity.

Background

      The conventional IHS attachment process (see Figure 1) has several problems that are not typically solved, including:

·        Slow epoxy sealant dispense times

·        Expensive clips that hold the spreader in place during epoxy cure that must be removed later

·        Oven-cure cycle required to harden the epoxy sealant

·        Oven-cure cycle to harden polymer thermal interface materials before clip removal (because the frame replaces clip and travels with the device, cure may be done at later burn-in process step)

·        Additional step after attachment (CTL) to remove the packages from production carriers to JDEC trays

Description

              The disclosed method provides a unique method of attaching an integrated heat spreader over the die and substrate of a microprocessor package. The key elements include:

·        Plastic frame with a barbed latching feature that surrounds the perimeter of the package substrate (see Figures 2 and 3)

·        Beveled/indented edge of the heat spreader that gives the barbed latches a surface that does not interfere with the second-level thermal interface

·        Lower substrate snap-in keeper

·        Upper heat spreader snap-in keeper

·        Frame bottom (see Figure 4)

      Given a snap-in frame material and dimensions that allow the proper compliance, the microprocessor substrate and heat spreader can be m...