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Method for added dielectric laminate PCB design for a socketless design for FCPGA package and motherboard direct contact assembly

IP.com Disclosure Number: IPCOM000006618D
Publication Date: 2002-Jan-16
Document File: 5 page(s) / 73K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for added dielectric laminate printed circuit board (PCB) design for a socketless design for flip-chip pin grid array (FCPGA) package and motherboard direct contact assembly. Benefits include a simplified assembly process, improved electrical performance, and improved environmental support.

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Method for added dielectric laminate PCB design for a socketless design for FCPGA package and motherboard direct contact assembly  

Disclosed is a method for added dielectric laminate printed circuit board (PCB) design for a socketless design for flip-chip pin grid array (FCPGA) package and motherboard direct contact assembly. Benefits include a simplified assembly process, improved electrical performance, and improved environmental support.

Background

      The conventional desktop (DT) and mobile system designs always have a socket on the motherboard (MB) for the pin grid array (PGA) (see Figure 1). An OEM socket is utilized to interconnect the FCPGA package and the MB. Bolt joints, heatsink clips, or alternative clamping mechanisms provide adequate compressive pressure to ensure robust electrical and thermal performance.

              Because of higher performance and smaller socket BGA joint pitch requirements, the fine-pitch surface-mounted socket for the FCPGA package is a costly component and may become a performance limiter.

              Conventional technology development includes a fine-pitch surface-mounted socket or land grid array (LGA) socket design that has limitations on the capability to achieve finer and finer pitch designs for the surface mounted PGA socket. The high-pressure requirement for the LGA socket also limits its future use.

              Indium is a well-known soft solder. This type of solder can be easily formed to fit the pin or stub shape.

Description

      The disclosed method includes a dielectric layer that is added to a printed circuit board. The method combines with system enabling designs for FCBGA, FCPLGA package, and motherboard PCB direct assembly (see Figure 2). The disclosed method re...