Browse Prior Art Database

SIMULTANEOUS FLUX DISPENSER AND PLACEMENT DEVICE FOR ROBOTS

IP.com Disclosure Number: IPCOM000006711D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2002-Jan-24
Document File: 1 page(s) / 52K

Publishing Venue

Motorola

Related People

Christopher L. Becher: AUTHOR [+4]

Abstract

In order to achieve a suitable method of Sh4T robotic assembly with a no-clean low viscosity flux, a simulta- neous placement/dispense method was developed The invention utilizes a flux dispenser which can be adapted to a robotic vacuum placement end effecter (picture attached).

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M M-LA INC.

Technical Developments Volume 17 December 1992

0

SIMULTANEOUS FLUX DISPENSER AND PLACEMENT DEVICE FOR ROBOTS

by Christopher L. Becher, Carl Raliegh, Steven M. Scheifers, Hoeng N. Hoeng

  In order to achieve a suitable method of Sh4T robotic assembly with a no-clean low viscosity flux, a simulta- neous placement/dispense method was developed The invention utilizes a flux dispenser which can be adapted to a robotic vacuum placement end effecter (picture attached).

  The process begins when the part is placed onto the PCB and held down by the vacuum placement tip. The flux tube, which is angled at the side of the chip, dis- penses a low volume of flux which flows under the chip. Once a sUacient amount of time for the flux to flow

under the chip has passed, the vacuum is turned off and the placement tip retreats.

  The simultaneous placement/dispense method reduces cycle time and the quantity of flux used. It elii- in&es the step needed for dressing the placement site with flux before placement, thus saving time. Also, since only a small amount of flux is needed to flow under the chip. Excessive flux is not needed on the placement site to ensure the part is covered, as was the case with older methods (screen printing, flux application on the com- ponent, or dispensing before placement).

Liquid Flux Dispense Head for Flip Chip Application

I

I

Robot , I

Microelectrode

Nonconductive

Placement Arm

Printed circuit board

\ Flip chip

0 Motomla, 1°C. 1992 123

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