Browse Prior Art Database

ADHESIVELESS HEATSINK ASSEMBLY FOR VERTICAL POWER DEVICES

IP.com Disclosure Number: IPCOM000006745D
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Jan-29
Document File: 2 page(s) / 88K

Publishing Venue

Motorola

Related People

Timothy S. Fisher: AUTHOR [+2]

Abstract

This invention allows multiple power devices to be tkmly secured against a heatsink by means of a single spring clip panel. By reducing parts count, this inven- tion drastically improves an assembly's manufacturabiity. Also, the invention circumvents the need for vibration supports and chemical adhesives, which can be messy, unsafe to operators, and environmentally harmful.

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MO7WROLA INC. Technical Developments Volume 18 March 1993

ADHESIVELESS HEATSINK ASSEMBLY ;FOR VERTICAL POWER DEVICES

by Timothy S. Fisher and Kenneth G. Stone

  This invention allows multiple power devices to be tkmly secured against a heatsink by means of a single spring clip panel. By reducing parts count, this inven- tion drastically improves an assembly's manufacturabiity. Also, the invention circumvents the need for vibration supports and chemical adhesives, which can be messy, unsafe to operators, and environmentally harmful.

  This invention has two main parts-a spring clip panel and a heatsink. Figure I shows a spring clip panel containing formed or molded spring clips, cutout regions for device placement, holes to allow for device lead clear- ance, and pins or snaps for securing the panel to a printed circuit board. The entire panel may be fabricated either from one piece of sheet metal in a progressive die, or from molded plastic. The heatsink is made from a thermally conductive metal, such as aluminum, and would contain a number of cavities equal to the number of mounted power devices. The heatsink provides the thermal path necessary to maintain power device junc- tion temperatures below the maximum specified tem- peratures for each device. The assembly method requires the following steps:

1. Placement of the speg clip panel on the PCB
2. Placement of the power devices
3. Wave soldering the assembly
4. Attachment ofthe h&sink
5. Potting or sealing the...