Browse Prior Art Database

DUAL DSP96002 MULTIPLE BUS ACTIVE SILICON SUBSTRATE MULTICHIP MODULE

IP.com Disclosure Number: IPCOM000006791D
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Feb-01
Document File: 2 page(s) / 107K

Publishing Venue

Motorola

Related People

David Paldan: AUTHOR [+2]

Abstract

The numerous inquiries in reference to our DSP Multichip Module projects have unveiled a tremendous problem. Every customer has a diierent systems archi- tecture that they would lie to implement into a module to match their specific application, yielding an exhorbitant amount of possible MCM's we may produce and rais- ing the question of whether each module is generic or custom. We cannot afford to produce all of the MCM's our customers need, yet we need to be their solution. Another major issue involving MCM's is testability Each microprocessor and memory block must have the capa- bility of being exposed to ease the testability issue. Yet, most of the architectures submitted by our customers do not allow direct access to the internal components.

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MOTOROLA INC. Technical Developments Volume 18 March 1993

DUAL DSP96002 MULTIPLE BUS ACTIVE SILICON SUBSTRATE MULTICHIP MODULE

by David Paldan and Federico E. de 10s Santos

  The numerous inquiries in reference to our DSP Multichip Module projects have unveiled a tremendous problem. Every customer has a diierent systems archi- tecture that they would lie to implement into a module to match their specific application, yielding an exhorbitant amount of possible MCM's we may produce and rais- ing the question of whether each module is generic or custom. We cannot afford to produce all of the MCM's our customers need, yet we need to be their solution. Another major issue involving MCM's is testability Each microprocessor and memory block must have the capa- bility of being exposed to ease the testability issue. Yet, most of the architectures submitted by our customers do not allow direct access to the internal components.

  Currently multichip modules are produced by using silicon (thin l&n), ceramic (thick tihn), or laminant mate- rials for substrates. The die may be attached by wirebond, TAB, or flipchip (C4), but the substrate merely routes connections much like a printed circuit board or a printed wiring board. So there are no active components within the substrate itself, although a few passive components may be created, such as, bypass capacitors in silicon and ceramic substrates.

  Our solution is to create a flexible architecture using active silicon substrates. Specitically, we have been work- ing with a DSP96002 architecture using multiple buses within the silicon substrate (Shown in Figure 1 on the

following page). The active silicon substrate allows our customers to design any architecture they desire with our DSP's. The ASIC in the block diagram is actually the active silicon substrate. All of the buses in the...