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Browse Prior Art Database

PRESSURE CONTACTS USED IN CONJUNCTION WITH CARBON INK AND ENTEK PCB'S

IP.com Disclosure Number: IPCOM000006815D
Original Publication Date: 1993-Mar-01
Included in the Prior Art Database: 2002-Feb-05
Document File: 1 page(s) / 39K

Publishing Venue

Motorola

Related People

Jeffrey King: AUTHOR [+3]

Abstract

Both carbon ink and Entek Tm coatings are becom- coil springs and other such current carrying members.

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MO-LA INC. Technical Developments Volume18 March 1993

PRESSURE CONTACTS USED IN CONJUNCTION

WITH CARBON INK AND ENTEK PCB'S

by Jeffrey King, Evencio Fernandez, and Guetavo G. Suarez

Both carbon ink and Entek Tm coatings are becom- coil springs and other such current carrying members.

ing very popular for use on PCB's. One of the primary A very low cost, and also highly reliable system which drawbacks of using these coatings is that they do not can be used, involves the incorporation of a gold plated offer an interfacing resistance which is low enough to plate, which is reflow soldered to the PCB pad, thus facilitate the use of pressure contacts. Popular pressure providing an adequate interface.
contacts include the use of bifurcated stamped parts,

GOLD PLATE

SOLDER PASTE

ENTEK COATING

0 Motorola. Inc. ,993 161

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