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Method for a thin high-power SMT socket with built-in power transfer bars

IP.com Disclosure Number: IPCOM000006840D
Publication Date: 2002-Feb-06
Document File: 4 page(s) / 38K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thin high-power surface-mount technology (SMT) socket with built-in power transfer bars. Benefits include improved functionality, improved quality, and improved ease of manufacturing.

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Method for a thin high-power SMT socket with built-in power transfer bars

Disclosed is a method for a thin high-power surface-mount technology (SMT) socket with built-in power transfer bars. Benefits include improved functionality, improved quality, and improved ease of manufacturing.

Background

              SMT requires power to be  supplied to the processor without going through the printed circuit board (PCB). The ultra-thin design and decreased size reduces the thickness, inductance, and resistance of the socket. Conventionally, this problem is solved by attaching an edge connector to the processor substrate or interposer (see Figure 1).

Description

              The disclosed method includes a thin SMT socket with resistors in the pad for mounting and unmounting without requiring a reflow oven or an external rework heater.

              The key elements of the method are:

•             A flex circuit with a frame for tension that has pads that align with the processor and CPU board mounting pads.

•             Designated pads have an attached power trace with a diode and an electrical trace to a conduction point outside the outline of the processor.

•             Contact pads are linked so that individual conduction points on the power bar can send electricity to multiple or single pads.

•             Each pad has a diode to limit electrical flow away from the pad when in contact with the processor.

•             An energizing tool can make contact with the outer contact points to supply the current required to the processor.

Advantages

The disclosed method presents several advantages over the conventional solution, including:

•             Improved functionality with a thin, flexible, membrane that compensates for board and processor warp

•             Simplified manufacturing process

              -             Elimination of th...