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Method for a socket with added solder materials for load bearing

IP.com Disclosure Number: IPCOM000006842D
Publication Date: 2002-Feb-06
Document File: 3 page(s) / 39K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a socket with added solder materials for load bearing. Benefits include improved reliability.

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Method for a socket with added solder materials for load bearing

Disclosed is a method for a socket with added solder materials for load bearing. Benefits include improved reliability.

Background

              The disclosed method addresses the problem of equalizing large loads over the entire socket. This problem is conventionally solved by adding glue or adhesive to the socket and processor board or by adding a fixture that is removed after reflow.

              Solder spheres and paste are a conventional way of mounting sockets and pads on processor boards (see Figure 1).

Description

              The disclosed method is a surface mount technology (SMT) socket for electronics with added solder material and socket pads for bearing the load from the heatsink and thermal interface materials (TIMs).

Advantages

              The disclosed method provides advantages over the conventional solution, including:

•             No reduction of the socket’s structural strength, as occurs with mass reduction

•             No requirement for added room on the processor board because this area is already covered by the socket

•             Ease of fabrication because boards already have pads in this general area

•             Reduction of the load stress per solder sphere and per area of the socket housing because of an increase in the support area

Detailed description

              The disclosed method is a standard surface-mounted socket with added attachment points of paste, solder spheres, or other SMT materials positioned to balance the socket load (see Figure 2).

              The standard socket creation proce...