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Method for a socket with added shock-absorbing materials

IP.com Disclosure Number: IPCOM000006843D
Publication Date: 2002-Feb-06
Document File: 3 page(s) / 392K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a socket with added shock-absorbing materials. Benefits include improved reliability.

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Method for a socket with added shock-absorbing materials

Disclosed is a method for a socket with added shock-absorbing materials. Benefits include improved reliability.

Description

              The disclosed method is a surface-mounted socket for electronics with added shock-absorbing material. The key elements include an added shock absorbing material between the socket and PCB for load bearing.

              Conventionally, exterior load bearing frames are added to the socket (see Figure 1). The disclosed method is a standard surface-mounted socket with additional attachment points of paste, solder spheres, or other surface mount technology (SMT) materials positioned to balance the socket load (see Figure 2).

      The standard socket creation process includes the following steps:

1.           Mold the base and cover.

2.           Mold or fabricate the lever.

3.           Form the contacts.

4.           Insert the contacts into the base.

5.           Snap on the cover.

6.           Attach the actuation mechanism to the socket.

7.           Put solder paste on the solder pad.

8.           Attach the solder balls to the pads (in the reflow oven).

9.           Attach thermally/mechanically-durable shock-absorption material to the socket.

Advantages

              An increase in the support area reduces the load stress per solder sphere and per area of the socket housing.

Fig. 1

Fig. 2

Disclosed anonymously