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Method for cooling a high-power microprocessor socket

IP.com Disclosure Number: IPCOM000006847D
Publication Date: 2002-Feb-06
Document File: 4 page(s) / 60K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for cooling a high-power microprocessor socket. Benefits include improved thermal performance.

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Method for cooling a high-power microprocessor socket

Disclosed is a method for cooling a high-power microprocessor socket. Benefits include improved thermal performance.

Background

   The power dissipation keeps increasing with each generation of faster microprocessors. This trend increases current through the sockets, resulting in more Joule heating. The air temperature inside the chassis is typically hotter than the outside ambient air because of the heat generated by the components inside the chassis. Conventional natural or forced-air convection is not sufficient to cool the socket. Applying a cooling solution to maintain the socket at the appropriate operating temperature is required to ensure socket reliability. Limiting the current through the socket solves this problem. However, it is a short-term solution and does not solve the problem for upcoming microprocessors with an even higher current requirement.

      The conventional socket (see Figure 1) is typically cooled by the conduction to the motherboard through the solder ball (shown) or pins (not shown), then by the convection to the ambient environment inside the chassis. Because an air gap exists between the motherboard and the chassis metal wall, the chassis wall is not effectively utilized for dissipating the heat generated by the socket.

General description

     The disclosed method creates a direct heat conduction path from the socket to the chassis metal wall by inserting a preformed (or dispensable/curable) elastomer with high thermal conductivity between the motherboard and the chassis wall. The chassis metal wall convects heat to the external ambient environment through a heat spreader, built-in heat fins, and folded fins.

     The key element of the method is the preformed (or dispensable/curable) highly conductive elastomer. It must be compliable to absorb stack-up tolerance variation and board warpage. The elastomer must not be electrically conductive to avoid motherboard circuit shortage. An optional heat spreader, built-in h...